購買 35ST685M5750X與BYCHPS
購買即有保證
35ST685M5750X
- 型號:
- 35ST685M5750X
- 製造商:
- Rubycon
- 描述:
- CAP FILM 6.8UF 20% 35VDC 2220
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17778 Pieces
簡單介紹
BYCHIPS是 35ST685M5750X的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的35ST685M5750X購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 35V |
|---|---|
| 額定電壓 - AC: | - |
| 公差: | ±20% |
| 終止: | - |
| 尺寸/尺寸: | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
| 系列: | PMLCAP®, ST |
| 封裝/箱體: | 2220 (5750 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | 35ST685M5750X |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.079" (2.00mm) |
| 特徵: | - |
| 展開說明: | 6.8µF ±20% Film Capacitor 35V Acrylic, Metallized 2220 (5750 Metric) |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Acrylic, Metallized |
| 描述: | CAP FILM 6.8UF 20% 35VDC 2220 |
| 電容: | 6.8µF |
| 應用: | DC Link, DC Filtering |
| Email: | [email protected] |
35ST685M5750X的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
DPFF2P33J-F | Cornell Dubilier Electronics (CDE) | CAP FILM 0.33UF 5% 250VDC RADIAL | 在線詢價 |
 |
35ST684M3216 | Rubycon | CAP FILM 0.68UF 20% 35VDC 1206 | 在線詢價 |
 |
BFC233990052 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
 |
35ST684MA23216 | Rubycon | CAP FILM 0.68UF 20% 35VDC 1206 | 在線詢價 |
 |
35ST685MD15750 | Rubycon | CAP FILM 6.8UF 20% 35VDC 2220 | 在線詢價 |
|
35ST685M5750 | Rubycon | CAP FILM 6.8UF 20% 35VDC 2220 | 在線詢價 |
|
35ST684M3216X | Rubycon | CAP FILM 0.68UF 20% 35VDC 1206 | 在線詢價 |
 |
664LC3700K5LM8 | Illinois Capacitor | CAP FILM 0.66UF 10% 700VAC SMD | 在線詢價 |
 |
ECH-U1C682JX5 | Panasonic Electronic Components | CAP FILM 6800PF 5% 16VDC 0805 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers