購買 16YXG8200MEFCGC18X35.5與BYCHPS
購買即有保證
16YXG8200MEFCGC18X35.5
- 型號:
- 16YXG8200MEFCGC18X35.5
- 製造商:
- Rubycon
- 描述:
- CAP ALUM 8200UF 20% 16V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14491 Pieces
簡單介紹
BYCHIPS是 16YXG8200MEFCGC18X35.5的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的16YXG8200MEFCGC18X35.5購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 16V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.709" Dia (18.00mm) |
| 系列: | YXG |
| 紋波電流: | 2.954A @ 120Hz |
| 極化: | Polar |
| 封装: | Tape & Box (TB) |
| 封裝/箱體: | Radial, Can |
| 工作溫度: | -40°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | 16YXG8200MEFCGC18X35.5 |
| 壽命@溫度。: | 6000 Hrs @ 105°C |
| 引線間距: | 0.295" (7.50mm) |
| 阻抗: | 14 mOhm |
| 高度 - 座高（最大）: | 1.476" (37.50mm) |
| 展開說明: | 8200µF 16V Aluminum Capacitors Radial, Can 6000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 8200UF 20% 16V RADIAL |
| 電容: | 8200µF |
| 應用: | General Purpose |
| Email: | [email protected] |
16YXG8200MEFCGC18X35.5的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
16YXG820MEFC12.5X16 | Rubycon | CAP ALUM 820UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG330M8X11.5 | Rubycon | CAP ALUM 330UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG10000MEFCGC18X40 | Rubycon | CAP ALUM 10000UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG8200MEFC18X35.5 | Rubycon | CAP ALUM 8200UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG470M8X16 | Rubycon | CAP ALUM 470UF 20% 16V RADIAL | 在線詢價 |
|
16YXG2200MEFC10X28 | Rubycon | CAP ALUM 2200UF 20% 16V RADIAL | 在線詢價 |
|
16YXG820MEFCG412.5X16 | Rubycon | CAP ALUM 820UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG120MEFC6.3X11 | Rubycon | CAP ALUM 120UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG470MEFCTC8X16 | Rubycon | CAP ALUM 470UF 20% 16V RADIAL | 在線詢價 |
|
16YXG2200MEFC10X20 | Rubycon | CAP ALUM 2200UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG680MEFC8X20 | Rubycon | CAP ALUM 680UF 20% 16V RADIAL | 在線詢價 |
 |
16YXG1500M12.5X20 | Rubycon | CAP ALUM 1500UF 20% 16V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers