購買 0MAB0001S與BYCHPS
購買即有保證
0MAB0001S
- 型號:
- 0MAB0001S
- 製造商:
- Littelfuse
- 描述:
- FUSE BLOCK BLADE 32V 60A CHASSIS
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 19615 Pieces
- 數據表:
- 0MAB0001S.pdf
簡單介紹
BYCHIPS是 0MAB0001S的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的0MAB0001S購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓: | 32V |
|---|---|
| 端接類型: | Screw Terminal |
| 系列: | MAB |
| 其他名稱: | MAB0001S |
| 方向: | - |
| 電路數: | 1 |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | 0MAB0001S |
| 保險絲座型: | Block |
| 保險絲類型: | Blade |
| 保險絲規格: | 1.15" L x 0.35" W x 1.35" H (29.21mm x 8.85mm x 34.29mm) |
| 適用於/相關產品: | MAXI® ATC, MAXI® ATO |
| 展開說明: | Fuse Block 60A 32V 1 Circuit Blade Chassis Mount |
| 描述: | FUSE BLOCK BLADE 32V 60A CHASSIS |
| 目前評級: | 60A |
| 觸點材料: | - |
| 觸點表面塗層: | - |
| Email: | [email protected] |
0MAB0001S的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
0MAB0001F | Littelfuse Inc. | FUSE BLOCK BLADE 60A CHASSIS MNT | 在線詢價 |
 |
02540207Z | Littelfuse Inc. | FUSE BLOCK CART 300V 10A CHASSIS | 在線詢價 |
 |
HLS | Eaton | FUSE BLOCK BLADE 125V 15A PCB | 在線詢價 |
|
LFH250601C | Littelfuse Inc. | FUSE BLOK CART 250V 60A DIN RAIL | 在線詢價 |
 |
BK/HTC-50M | Eaton | FUSE HOLDER CART 250V 6.3A PCB | 在線詢價 |
|
T30030-3CR | Eaton | FUSE BLOCK CART 300V 30A CHASSIS | 在線詢價 |
|
0MAB0001XP | Littelfuse Inc. | FUSE BLOCK BLADE 60A CHASSIS MNT | 在線詢價 |
|
G30060-2CR | Eaton | FUSE BLK CART 480V 60A CHASS MNT | 在線詢價 |
|
FHJC2002G | Littelfuse Inc. | FUSE HOLDER 58V 60A IN LINE | 在線詢價 |
|
2607 | Eaton | BUSS FUSEBLOCK | 在線詢價 |
 |
2541000 | American Electrical Inc. | FUSEBLOCK 1POLE 10MMX38MM DNRAIL | 在線詢價 |
 |
03540005ZXGY | Littelfuse Inc. | FUSE BLOCK CART 600V 30A CHASSIS | 在線詢價 |
|
02982002ZXT | Littelfuse Inc. | FUSE BLOK BLT DWN 32V 500A CHASS | 在線詢價 |
|
LFJ104001CST | Littelfuse Inc. | 1000VDC 400A SPFJ HLDR 1PLE STD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers