購買 03540525Z與BYCHPS
購買即有保證
03540525Z
- 型號:
- 03540525Z
- 製造商:
- Littelfuse
- 描述:
- FUSE TERM LOCK TYPE 2
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18347 Pieces
- 數據表:
- 03540525Z.pdf
簡單介紹
BYCHIPS是 03540525Z的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的03540525Z購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 系列: | ATO® |
|---|---|
| 其他名稱: | 3540525Z |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | 03540525Z |
| 適用於/相關產品: | Fuse Module; MINI® ATO, ATC |
| 描述: | FUSE TERM LOCK TYPE 2 |
| 附件類型: | BLOK LOKS™ |
| Email: | [email protected] |
03540525Z的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
03540518Z | Littelfuse Inc. | FUSE MOUNT ACS LEG 3" | 在線詢價 |
 |
03540544Z | Littelfuse Inc. | FUSE BLOCK BLADE 60A | 在線詢價 |
|
03540527Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 4 | 在線詢價 |
|
03540522Z | Littelfuse Inc. | FUSE ACS STORAGE DRAWER | 在線詢價 |
|
03540540Z | Littelfuse Inc. | FUSE ACS BLOK SIDE MTNG BRACK | 在線詢價 |
|
03540506Z | Littelfuse Inc. | RELAY SOCKET HOUSING ISO | 在線詢價 |
|
03540528Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 5 | 在線詢價 |
|
03540521Z | Littelfuse Inc. | FUSE ACS BLOCK STORAGE | 在線詢價 |
|
03540531Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 8 | 在線詢價 |
|
03540545Z | Littelfuse Inc. | INSULATOR 3-POS. BUS BAR .39 | 在線詢價 |
|
03540539Z | Littelfuse Inc. | FUSE ACS POWER TAP MOD M8 THRD | 在線詢價 |
|
03540524Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 1 | 在線詢價 |
|
03540529Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 6 | 在線詢價 |
|
03540515Z | Littelfuse Inc. | FUSE MOUNT ACS STAND OFF .75" | 在線詢價 |
|
03540520Z | Littelfuse Inc. | FUSE MODULE BLANK SINGLE | 在線詢價 |
|
03540526Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 3 | 在線詢價 |
|
03540547Z | Littelfuse Inc. | INSULATOR 5-POS. BUS BAR .39 | 在線詢價 |
 |
03540523Z | Littelfuse Inc. | FUSE ACS WEDGE | 在線詢價 |
|
03540519Z | Littelfuse Inc. | FUSE MOUNT ACS LEG FLUSH | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers