購買 TSE2002GB2A1NCG與BYCHPS
購買即有保證
TSE2002GB2A1NCG
- 型號:
- TSE2002GB2A1NCG
- 描述:
- IC TEMP SENS EEPROM DFN-8
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18757 Pieces
簡單介紹
BYCHIPS是 TSE2002GB2A1NCG的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TSE2002GB2A1NCG購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.3 V ~ 3.6 V |
|---|---|
| 拓撲: | ADC, Register Bank |
| 供應商設備封裝: | 8-VFQFPN (2x3) |
| 系列: | - |
| 傳感器類型: | Internal |
| 感應溫度: | -20°C ~ 125°C |
| 封装: | Tube |
| 封裝/箱體: | 8-WFDFN Exposed Pad, CSP |
| 輸出類型: | I²C/SMBus |
| 輸出風扇: | No |
| 輸出報警: | No |
| 其他名稱: | IDTTSE2002GB2A1NCG IDTTSE2002GB2A1NCG-ND |
| 工作溫度: | -20°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | TSE2002GB2A1NCG |
| 功能: | Temp Monitoring System (Sensor) |
| 展開說明: | Temp Monitoring System (Sensor) -20°C ~ 125°C Internal Sensor I²C/SMBus Output 8-VFQFPN (2x3) |
| 描述: | IC TEMP SENS EEPROM DFN-8 |
| 準確性: | ±2°C |
| Email: | [email protected] |
TSE2002GB2A1NCG的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
TSE2002GB2A1NRG8 | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM DFN-8 | 在線詢價 |
|
TSE2002GB2A1NRG | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM DFN-8 | 在線詢價 |
|
TSE2002B3CNRG | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM DFN-8 | 在線詢價 |
|
TSE2002B3CNCG | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM TDFN-8 | 在線詢價 |
|
TSE2002B3CNCG8 | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM TDFN-8 | 在線詢價 |
|
TSE2004GB2B0NCG8 | IDT, Integrated Device Technology Inc | TEMPERATURE SENSOR FOR DDR4 | 在線詢價 |
|
TSE2002GB2A1NCG8 | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM DFN-8 | 在線詢價 |
|
TSE2002B3CNRG8 | IDT, Integrated Device Technology Inc | IC TEMP SENS EEPROM DFN-8 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers