購買 ST10R272LT1/TR與BYCHPS
購買即有保證
ST10R272LT1/TR
- 型號:
- ST10R272LT1/TR
- 製造商:
- ST
- 描述:
- IC MCU 16BIT ROMLESS 100TQFP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13256 Pieces
簡單介紹
BYCHIPS是 ST10R272LT1/TR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ST10R272LT1/TR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 3 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 100-TQFP (14x14) |
| 速度: | 50MHz |
| 系列: | ST10 |
| RAM容量: | 1K x 8 |
| 程序存儲器類型: | ROMless |
| 程序存儲器大小: | - |
| 外設: | POR, PWM, WDT |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 100-LQFP |
| 振盪器型: | Internal |
| 工作溫度: | 0°C ~ 70°C (TA) |
| I / O數量: | 77 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | ST10R272LT1/TR |
| 展開說明: | ST10 ST10 Microcontroller IC 16-Bit 50MHz ROMless 100-TQFP (14x14) |
| EEPROM容量: | - |
| 描述: | IC MCU 16BIT ROMLESS 100TQFP |
| 數據轉換器: | - |
| 核心尺寸: | 16-Bit |
| 核心處理器: | ST10 |
| 連通性: | EBI/EMI, SSP, UART/USART |
| Email: | [email protected] |
ST10R272LT1/TR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
ST10R272LT6 | STMicroelectronics | IC MCU 16BIT ROMLESS 100TQFP | 在線詢價 |
 |
C8051F333-GMR | Silicon Labs | IC MCU 8BIT 4KB FLASH 20QFN | 在線詢價 |
|
ST10R172LT6 | STMicroelectronics | IC MCU 16BIT ROMLESS 100TQFP | 在線詢價 |
|
MSP430FR5727IDAR | Texas Instruments | IC MCU 16BIT 16KB FRAM 38TSSOP | 在線詢價 |
 |
ST10R167-Q3 | STMicroelectronics | IC MCU 16BIT ROMLESS 144QFP | 在線詢價 |
 |
LPC11E36FBD64/501E | NXP USA Inc. | IC MCU 32BIT 96KB FLASH 64LQFP | 在線詢價 |
|
ST10R272LT1 | STMicroelectronics | IC MCU 16BIT ROMLESS 100TQFP | 在線詢價 |
 |
R5F72394ADFP#V0 | Renesas Electronics America | IC MCU 32BIT 256KB FLASH 120LQFP | 在線詢價 |
|
ST10R172LT1 | STMicroelectronics | IC MCU 16BIT ROMLESS 100TQFP | 在線詢價 |
|
ST10R167-Q3/TR | STMicroelectronics | IC MCU 16BIT ROMLESS 144QFP | 在線詢價 |
 |
ATTINY13-20SUR | Microchip Technology | IC MCU 8BIT 1KB FLASH 8SOIC | 在線詢價 |
|
PIC24FJ256GA106T-I/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 64TQFP | 在線詢價 |
|
PCF52258AG80 | NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144LQFP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers