購買 PEF 22552 E V1.1與BYCHPS
購買即有保證
PEF 22552 E V1.1
- 型號:
- PEF 22552 E V1.1
- 描述:
- IC LIU E1/T1/J1 160LBGA
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 15496 Pieces
簡單介紹
BYCHIPS是 PEF 22552 E V1.1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PEF 22552 E V1.1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.8V, 3.3V |
|---|---|
| 供應商設備封裝: | P-LBGA-160 |
| 系列: | DualFALC™ |
| 功率（瓦特）: | - |
| 封装: | Tray |
| 封裝/箱體: | 160-LBGA |
| 其他名稱: | PEF22552EV1.1 PEF22552EV11NP SP000081344 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 2 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | PEF 22552 E V1.1 |
| 接口: | E1, HDLC, J1, T1 |
| 包括: | CAS Controller, Clock Generation, CRC-4 Monitor, LOS / AIS / RAI Alarm Detection and Generation, PRBS Generation and Monitoring |
| 功能: | Framer, Line Interface Unit (LIU) |
| 展開說明: | Telecom IC Framer, Line Interface Unit (LIU) P-LBGA-160 |
| 描述: | IC LIU E1/T1/J1 160LBGA |
| 供電: | - |
| Email: | [email protected] |
PEF 22552 E V1.1的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers