購買 LTC2704IGW-12#TRPBF與BYCHPS
購買即有保證
LTC2704IGW-12#TRPBF
- 型號:
- LTC2704IGW-12#TRPBF
- 製造商:
- L
- 描述:
- IC DAC 12BIT QUAD VOUT 44-SSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13295 Pieces
簡單介紹
BYCHIPS是 LTC2704IGW-12#TRPBF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的LTC2704IGW-12#TRPBF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源，數字: | 2.7 V ~ 5.5 V |
|---|---|
| 電壓 - 電源，模擬: | ±4.5 V ~ 16.5 V |
| 供應商設備封裝: | 44-SSOP |
| 建立時間: | 8µs (Typ) |
| 系列: | SoftSpan™ |
| 參考類型: | External |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 44-BSOP (0.295", 7.50mm Width) |
| 輸出類型: | Voltage - Buffered |
| 工作溫度: | -40°C ~ 85°C |
| D / A轉換器數量: | 4 |
| 比特數: | 12 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | LTC2704IGW-12#TRPBF |
| INL / DNL（LSB）: | ±1 (Max), ±1 (Max) |
| 展開說明: | 12 Bit Digital to Analog Converter 4 44-SSOP |
| 差分輸出: | No |
| 描述: | IC DAC 12BIT QUAD VOUT 44-SSOP |
| 數據接口: | SPI |
| 建築: | - |
| Email: | [email protected] |
LTC2704IGW-12#TRPBF的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
LTC2704CGW-12#TRPBF | Linear Technology | IC DAC 12BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704IGW-16#TRPBF | Linear Technology | IC DAC 16BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704CGW-14#PBF | Linear Technology | IC DAC 14BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704IGW-14#TRPBF | Linear Technology | IC DAC 14BIT QUAD VOUT 44-SSOP | 在線詢價 |
 |
LTC2704CGW-16#PBF | Linear Technology | IC DAC 16BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704CGW-12#PBF | Linear Technology | IC DAC 12BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704CGW-14#TRPBF | Linear Technology | IC DAC 14BIT QUAD VOUT 44-SSOP | 在線詢價 |
 |
LTC2704IGW-16#PBF | Linear Technology | IC DAC 16BIT QUAD VOUT 44-SSOP | 在線詢價 |
 |
LTC2704IGW-12#PBF | Linear Technology | IC DAC 12BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704IGW-14#PBF | Linear Technology | IC DAC 14BIT QUAD VOUT 44-SSOP | 在線詢價 |
|
LTC2704CGW-16#TRPBF | Linear Technology | IC DAC 16BIT QUAD VOUT 44-SSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers