購買 KTJ500B226M76AFT00與BYCHPS
購買即有保證
KTJ500B226M76AFT00
- 型號:
- KTJ500B226M76AFT00
- 製造商:
- Nippon Chemi-Con
- 描述:
- CAP CER 22UF 50V X7R SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19611 Pieces
簡單介紹
BYCHIPS是 KTJ500B226M76AFT00的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的KTJ500B226M76AFT00購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±20% |
| 厚度（最大）: | 0.217" (5.50mm) |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.260" L x 0.307" W (6.60mm x 7.80mm) |
| 系列: | KTJ, NTJ |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | SMD, J-Lead |
| 其他名稱: | 565-4685-2 KTJ500B226M76AFT00-ND |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | KTJ500B226M76AFT00 |
| 引線型: | J-Lead |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | Low ESL |
| 展開說明: | 22µF ±20% 50V Ceramic Capacitor X7R SMD, J-Lead |
| 描述: | CAP CER 22UF 50V X7R SMD |
| 電容: | 22µF |
| 應用: | Bypass, Decoupling |
| Email: | [email protected] |
KTJ500B226M76AFT00的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
1808Y2000221JXR | Knowles Syfer | CAP CER 1808 | 在線詢價 |
 |
KTJ500B226M55BFT00 | United Chemi-Con | CAP CER 22UF 50V X7R SMD | 在線詢價 |
|
KTJ500B156M55AFT00 | United Chemi-Con | CAP CER 15UF 50V X7R SMD | 在線詢價 |
|
1812J2K00272JXT | Knowles Syfer | CAP CER 1812 | 在線詢價 |
|
2225J1K00562JFR | Knowles Syfer | CAP CER 2225 | 在線詢價 |
|
KTJ500B156M55BFT00 | United Chemi-Con | CAP CER 15UF 50V X7R SMD | 在線詢價 |
|
1812Y0500392FFT | Knowles Syfer | CAP CER 3900PF 50V C0G/NP0 1812 | 在線詢價 |
|
KTJ500B476M76BFT00 | United Chemi-Con | CAP CER 47UF 50V X7R SMD | 在線詢價 |
|
KTJ500B336M76BFT00 | United Chemi-Con | CAP CER 33UF 50V X7R SMD | 在線詢價 |
 |
1206J2500183MXT | Knowles Syfer | CAP CER 1206 | 在線詢價 |
 |
C1210C685M4VACTU | KEMET | CAP CER 6.8UF 16V Y5V 1210 | 在線詢價 |
 |
SR201C103KAR | AVX Corporation | CAP CER 10000PF 100V X7R RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers