購買 IRGS6B60KDPBF與BYCHPS
購買即有保證
IRGS6B60KDPBF
- 型號:
- IRGS6B60KDPBF
- 描述:
- IGBT 600V 13A 90W D2PAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18384 Pieces
簡單介紹
BYCHIPS是 IRGS6B60KDPBF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IRGS6B60KDPBF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.2V @ 15V, 5A |
| 測試條件: | 400V, 5A, 100 Ohm, 15V |
| Td（開/關）@ 25°C: | 25ns/215ns |
| 開關能量: | 110µJ (on), 135µJ (off) |
| 供應商設備封裝: | D2PAK |
| 系列: | - |
| 反向恢復時間（trr）: | 70ns |
| 功率 - 最大: | 90W |
| 封装: | Tube |
| 封裝/箱體: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 其他名稱: | *IRGS6B60KDPBF 63-2003PBF 63-2003PBF-ND SP001542298 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | IRGS6B60KDPBF |
| 輸入類型: | Standard |
| IGBT類型: | NPT |
| 柵極電荷: | 18.2nC |
| 展開說明: | IGBT NPT 600V 13A 90W Surface Mount D2PAK |
| 描述: | IGBT 600V 13A 90W D2PAK |
| 電流 - 集電極脈衝（ICM）: | 26A |
| 電流 - 集電極（Ic）（最大）: | 13A |
| Email: | [email protected] |
IRGS6B60KDPBF的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IRGS6B60KTRLPBF | Infineon Technologies | IGBT 600V 13A 90W D2PAK | 在線詢價 |
|
IRGS6B60KDTRRP | Infineon Technologies | IGBT 600V 13A 90W D2PAK | 在線詢價 |
 |
IXGA20N120B3 | IXYS | IGBT 1200V 36A 180W TO263 | 在線詢價 |
 |
RGT60TS65DGC11 | Rohm Semiconductor | IGBT 650V 55A 194W TO-247N | 在線詢價 |
|
IRGS6B60KPBF | Infineon Technologies | IGBT 600V 13A 90W D2PAK | 在線詢價 |
|
IRGS6B60KDTRLP | Infineon Technologies | IGBT 600V 13A 90W D2PAK | 在線詢價 |
 |
GPA020A135MN-FD | Global Power Technologies Group | IGBT 1350V 40A 223W TO3PN | 在線詢價 |
 |
IXGR40N60B2 | IXYS | IGBT 600V 60A 167W ISOPLUS247 | 在線詢價 |
 |
IXGT60N60B2 | IXYS | IGBT 600V 75A 500W TO268 | 在線詢價 |
 |
IXYX140N90C3 | IXYS | IGBT 900V 310A 1630W TO247 | 在線詢價 |
 |
IGZ50N65H5XKSA1 | Infineon Technologies | IGBT 650V 50A SGL TO-247-4 | 在線詢價 |
 |
IRG4BC20F-SPBF | Infineon Technologies | IGBT 600V 16A 60W TO220-3 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers