購買 BFP196E6327HTSA1與BYCHPS
購買即有保證
BFP196E6327HTSA1
- 型號:
- BFP196E6327HTSA1
- 描述:
- TRANSISTOR NPN RF 12V SOT-143
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16022 Pieces
簡單介紹
BYCHIPS是 BFP196E6327HTSA1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BFP196E6327HTSA1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 12V |
|---|---|
| 晶體管類型: | NPN |
| 供應商設備封裝: | PG-SOT143-4 |
| 系列: | - |
| 功率 - 最大: | 700mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-253-4, TO-253AA |
| 其他名稱: | BFP 196 E6327 BFP 196 E6327-ND BFP196E6327BTSA1 BFP196E6327HTSA1TR BFP196E6327INTR BFP196E6327INTR-ND BFP196E6327XT SP000011027 |
| 工作溫度: | 150°C (TJ) |
| 噪聲係數（dB典型值@頻率）: | 1.3dB ~ 2.3dB @ 900MHz ~ 1.8GHz |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | BFP196E6327HTSA1 |
| 獲得: | 10.5dB ~ 16.5dB |
| 頻率 - 轉換: | 7.5GHz |
| 展開說明: | RF Transistor NPN 12V 150mA 7.5GHz 700mW Surface Mount PG-SOT143-4 |
| 描述: | TRANSISTOR NPN RF 12V SOT-143 |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 70 @ 50mA, 8V |
| 電流 - 集電極（Ic）（最大）: | 150mA |
| Email: | [email protected] |
BFP196E6327HTSA1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
2304 | Microsemi Corporation | TRANS BIPO 20V 4W 55BT | 在線詢價 |
 |
BFP196WH6327XTSA1 | Infineon Technologies | TRANS RF NPN 12V 150MA SOT343 | 在線詢價 |
|
BFP196WE6327HTSA1 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-343 | 在線詢價 |
|
BFP193WH6327XTSA1 | Infineon Technologies | TRANS RF NPN 12V 80MA SOT343 | 在線詢價 |
 |
2SC3932GSL | Panasonic Electronic Components | TRANS NPN 20VCEO 50MA SMINI-3 | 在線詢價 |
 |
BFS 483 E6327 | Infineon Technologies | TRANSISTOR RF NPN 12V SOT-363 | 在線詢價 |
|
MS1003 | Microsemi Corporation | TRANS RF BIPO 270W 20A TO-220AC | 在線詢價 |
|
JANTX2N4957 | Microsemi Corporation | TRANS PNP 30V 30MA TO72 | 在線詢價 |
|
BFP193WE6327HTSA1 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-343 | 在線詢價 |
 |
KSC2756YMTF | Fairchild/ON Semiconductor | TRANSISTOR NPN 20V 30MA SOT-23 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers