購買 89HPES12N3AZGBC與BYCHPS
購買即有保證
89HPES12N3AZGBC
- 型號:
- 89HPES12N3AZGBC
- 描述:
- IC PCI SW 12LANE 3PORT 324-BGA
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 16501 Pieces
簡單介紹
BYCHIPS是 89HPES12N3AZGBC的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的89HPES12N3AZGBC購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 3.3V |
|---|---|
| 供應商設備封裝: | 324-CABGA (19x19) |
| 系列: | PRECISE™ |
| 封装: | Tray |
| 封裝/箱體: | 324-LBGA |
| 其他名稱: | IDT89HPES12N3AZGBC IDT89HPES12N3AZGBC-ND |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 4 (72 Hours) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | 89HPES12N3AZGBC |
| 接口: | PCI Express |
| 展開說明: | Switch Interfacing Interface 324-CABGA (19x19) |
| 描述: | IC PCI SW 12LANE 3PORT 324-BGA |
| 應用: | Switch Interfacing |
| Email: | [email protected] |
89HPES12N3AZGBC的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers