購買 74AVC1T45GM,132與BYCHPS
購買即有保證
74AVC1T45GM,132
- 型號:
- 74AVC1T45GM,132
- 製造商:
- Nexperia
- 描述:
- IC TRANSCVR TRI-ST DL SPLY 6XSON
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15095 Pieces
簡單介紹
BYCHIPS是 74AVC1T45GM,132的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74AVC1T45GM,132購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | 0.8 V ~ 3.6 V |
|---|---|
| 電壓 - VCCA: | 0.8 V ~ 3.6 V |
| 翻譯類型: | Voltage Level |
| 供應商設備封裝: | 6-XSON, SOT886 (1.45x1) |
| 系列: | 74AVC |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-XFDFN |
| 輸出類型: | Tri-State, Non-Inverted |
| 輸出信號: | - |
| 其他名稱: | 74AVC1T45GM-H 74AVC1T45GM-H-ND 935284154132 |
| 工作溫度: | -40°C ~ 125°C (TA) |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | 74AVC1T45GM,132 |
| 輸入信號: | - |
| 特徵: | - |
| 展開說明: | Voltage Level Translator Bidirectional 1 Circuit 1 Channel 500Mbps 6-XSON, SOT886 (1.45x1) |
| 描述: | IC TRANSCVR TRI-ST DL SPLY 6XSON |
| 數據速率: | 500Mbps |
| 每路電路: | 1 |
| 基射極飽和電壓（最大值）: | Bidirectional |
| Email: | [email protected] |
74AVC1T45GM,132的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74AVC1T45GM,115 | Nexperia USA Inc. | IC TRANSCVR TRI-ST DL SPLY 6XSON | 在線詢價 |
|
74AVC16836ADGG,112 | Nexperia USA Inc. | IC RGSTRD DVR 3-ST 20BIT 56TSSOP | 在線詢價 |
 |
74AVC1T45GW,125 | Nexperia USA Inc. | IC TXRX TRI-ST DL SPLY 6TSSOP | 在線詢價 |
|
74AVC16374DGG,112 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 48TSSOP | 在線詢價 |
 |
74AVC1T45GS,132 | Nexperia USA Inc. | TRANSLATING TRANSCEIVER 6XSON | 在線詢價 |
|
74AVC1T45GW-Q100H | Nexperia USA Inc. | IC LEVEL TRANSLATOR/TXRX SC-88 | 在線詢價 |
|
74AVC1T45GN,132 | Nexperia USA Inc. | TRANSLATING TRANSCEIVER 6XSON | 在線詢價 |
|
74AVC16334ADGG,118 | Nexperia USA Inc. | IC UNIV BUS DVR 16BIT 48TSSOP | 在線詢價 |
 |
74AVC16T245EV/G,51 | Nexperia USA Inc. | IC TRANSCEIVER 16BIT 3ST 56VFBGA | 在線詢價 |
|
74AVC16374DGG,118 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 48TSSOP | 在線詢價 |
|
74AVC16T245DGG,112 | Nexperia USA Inc. | TXRX 16BIT TRANSLAT 48TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers