購買 337TMA035M與BYCHPS
購買即有保證
337TMA035M
- 型號:
- 337TMA035M
- 描述:
- CAP ALUM 330UF 20% 35V THRU HOLE
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15804 Pieces
- 數據表:
- 337TMA035M.pdf
簡單介紹
BYCHIPS是 337TMA035M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的337TMA035M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 35V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.394" Dia x 0.827" L (10.00mm x 21.00mm) |
| 系列: | TMA |
| 紋波電流: | 330mA |
| 極化: | Polar |
| 封装: | Bulk |
| 封裝/箱體: | Axial, Can |
| 工作溫度: | -40°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | 337TMA035M |
| 壽命@溫度。: | 2000 Hrs @ 105°C |
| 引線間距: | - |
| 阻抗: | - |
| 高度 - 座高（最大）: | - |
| 展開說明: | 330µF 35V Aluminum Capacitors Axial, Can 703 mOhm @ 120Hz 2000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | 703 mOhm @ 120Hz |
| 描述: | CAP ALUM 330UF 20% 35V THRU HOLE |
| 電容: | 330µF |
| 應用: | Bypass, Decoupling |
| Email: | [email protected] |
337TMA035M的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers